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0:11
YouTube
Electronics Education
IC Packages - DIP vs SOP
DIP (Dual In-line Package) and SOP (Small Outline Package) are two common IC packaging types. DIP uses through-hole pins, making it larger, easy for breadboard prototyping, and mechanically strong, but bulky. SOP uses surface-mount leads, making it smaller, lighter, and ideal for compact PCBs, but less robust and requires custom boards. DIP is ...
6.7K views
3 months ago
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