At long last, HBM4 is officially here—at least as a specification. The JEDEC released Standard 270-4, supplying high ...

JEDEC announced the publication of the HBM4 DRAM standard, delivering higher bandwidth, efficiency, and capacity for AI and ...

Selling Micron Technologies in the current environment isn't sensible due to its strong US manufacturing footprint and ...

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of its highly anticipated High Bandwidth ...

Fresh off a merger that created South Korea’s first AI chip unicorn, Rebellions’ head Sunghyun Park is readying the next ...

China's Honor has unveiled the world's first 8,000 mAh silicon carbon-based battery in its mid-range phone aptly called the ...

The global push to meet surging demand from AI, high-performance computing (HPC), and advanced data centers has reached a new ...

It delivers 188GB of HBM3 memory to power today's most demanding AI models at the edge. Along with its AI/ML edge computing capability, this latest and most advanced carry-on-compliant form factor ...

The HGX H20 system board that has been available in China since late 2023 has eight H20 GPUs, which have 96 GB of HBM3 stacked DRAM and 4 TB/sec of bandwidth on that memory. The most capacious H100 ...