But notably, OSCs with thinner active layers demonstrated better radiation resistance and more effective recovery after ...

Renesas says the restructuring agreement just signed with the US SiC chip firm Wolfspeed will result in a significant ...

The Compound Semiconductor Applications (CSA) Catapult will mobilise the new UK Semiconductor Centre (UKSC). This ...

Toyota is using a power module equipped with Rohm's 4th generation SiC MOSFET bare chip in the traction inverter of its new ...

To produce their mirrors by MOCVD, the team employed a temperature difference of just 150 °C between InGaN and the AlGaN/GaN ...

Wolfspeed has entered into a Restructuring Support Agreement (RSA)with key lenders, including holders of more than 97 percent ...

Goleta-based Aeluma, a start-up company combining compound semiconductor nanomaterials with silicon manufacturing, has announced a contract with the US Navy that could accelerate development of ...

Compound semiconductor wafer company IQE plc and Quinas Technology, a British semiconductor company, have completed a £1.1 ...

The resulting submicron LEDs, some as small as 250nm by 250nm, initially demonstrated promising electrical characteristics, ...

Swansea University and Space Forge, pioneer in space-based materials manufacturing, have signed a major deal, making the ...

Veeco Instruments has announced that the University of Michigan has published a breakthrough study on atomic layer deposition ...

Now researchers from University of Science and Technology of China (USTC) have demonstrated a vertical GaN PiN diode with a ...