All three stages of chip design will be automated and accelerated, says Moores Lab AI, which has introduced four design tools ...

Institute of Science Tokyo revealed advances to its BBCube 3D integration process at ECTC, the IEEE Electronic Components and ...

Leading figures in the Space industry will appear before a cross-party Lords Committee on Monday June 23 to discuss the Space ...

Although China has robotaxis operating in seven cities with Baidu, Pony.ai and WeRide providing most of the rides, the US has ...

Wevo has created three soft potting compounds that can be used "for wire bonds and inductive components such as chokes or ...

Bath University shares details of its TOPCAT II payload featuring a multi-frequency GPS receiver, for the Orpheus space ...

The Kiel Institute for the World Economy has released a new report outlining how Europe could replace U.S. support for Ukraine both financially and ...

Episode 10 of our podcast CHIIPs is out now, featuring DAC conference chair Professor Helen Li. Helen discusses her plans for ...

X-Fab has improved 25V isolation for better SPAD integration in its 180nm XH018 fab process. 4x3 SPAD arrays: Original ...

Filtronic is aiming at satellite up-links with a 500W V-band linear RF amplifier. Called Prometheus, it was unveiled at the ...

Greenerwave wins a €10 million contract to help provide French armed forces with satellite connectivity using its terminal.

Mechanical stuff never ceases to amaze me. The latest revelation is that one can weigh an aeroplane flying overhead from the ...