This report focuses on different interconnect structures, such as lines, vias, buses, and networks-on-chip, and how they’re constructed. As always, we consider the design, test, reliability, and ...

A new technical paper titled “Augmenting Von Neumann’s Architecture for an Intelligent Future” was published by researchers ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

AI and HPC are fueling much-needed investment in panel-level tooling and processes. An insatiable demand for logic to memory ...

Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing ...

Free Analog Computing with Imperfect Hardware” was published by researchers at The University of Hong Kong, University of ...

Before the transition can be made from custom chiplet environments to a standardized off-the-shelf open marketplace, an ...

A new technical paper titled “Thin-film lithium niobate quantum photonics: review and perspectives” was published by ...

In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of ...

In the world of EDA, Jay Vleeschhouwer, managing director of software research at Griffin Securities, needs no introduction.

The Largest, Highest-Quality Dataset with a Preprocessing Framework for LLM-based RTL Generation” was published by ...

A new technical paper titled “Efficient Hardware-Assisted Heap Memory Safety for Embedded RISC-V Systems” was published by ...