In New test points slash ATPG test pattern count, I described a new type of test point technology used with scan compression for device testing. The key benefit of using test points with embedded ...

Scan testing has been the foundation of digital-device production test for many years. Several innovations have been developed to keep up with the growth in pattern-set sizes brought about by large ...

Recent and continuing trends in the semiconductor industry pose challenges to IC test-data volumes, test application times, and test costs. The industry has thus far succeeded in containing test costs ...

Test points for hybrid ATPG/LBIST applications make it easier to reach the ISO 26262 standard of 90% stuck-at coverage for in-system test. The remarkable growth in automotive IC design has prompted a ...

The exponential growth in design sizes has rendered the traditional methods of design-for-test, layout, and timing closure no longer sufficient. Design and test engineers not only have to constantly ...

The trend in semiconductors leads to more IC test data volume, longer test times, and higher test costs. Embedded deterministic test (EDT) has continued to deliver more compression, which has been ...

In the upcoming NFPA 70E 2024 Edition, the inclusion of the phrase “at each point of work” and the relationship to absence of voltage testing has prompted questions regarding the use of Permanent ...

The parts are engineered for high-density packaging on 0.062 and 0.093-in.-thick PC boards. They ensure firm gripping with J-hooks, EZ-hooks, grabbers, alligator clips, tips, or probes and keep ...