TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...

Apple is working with semiconductor company Broadcom on its first server chip designed to handle AI applications, according to The Information, which cited three people with knowledge of the project.

A team of engineers, AI specialists and chip design researchers at the Chinese Academy of Sciences has designed, built and tested what they are describing as the first AI-based chip design system. The ...

Per Ming-Chi Kuo, Apple appears set to start mass-producing its new in-house AI server chips as soon as this year.