New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor packaging. The company ...

It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

TL;DR: Samsung Electronics is prioritizing advanced semiconductor packaging and robotics as key growth engines, focusing on next-gen glass interposers to enhance AI chip performance by 2028. The ...

Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment and consumables enabling AI semiconductor device packaging and advanced substrate fabrication, will announce financial ...

As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced packaging ...

Korean electronic components manufacturer LG Innotek said Thursday that it has partnered with glass processing specialist UTI as it moves to expand its presence ...

China-based display solutions supplier BOE Technology has unveiled a roadmap for diversification into making glass substrates for semiconductor packaging. Save my User ID and Password Some subscribers ...