CHANDLER, Ariz., Dec. 06, 2023 (GLOBE NEWSWIRE) -- The E-Mobility, sustainability and data center markets require products that are conducive to high-volume ...
Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...
Press-fit terminals provide a solder-free capability to mount power modules to a printed circuit board (PCB). Microchip Technology Inc. has announced a broad portfolio of SP1F and SP3F power modules ...
A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...
Microchip has announced a range of integrated power modules for applications including more-electric aircraft (MEA). Output power rating starts at 5kVA. Little hard information is yet available, but ...
Recent developments in IGBT and FWD (free wheeling diode) devices are enabling designers to achieve higher switching performance, lower electrical losses, and higher temperature operation in high ...
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