Hybrid bonds, securities blending debt and equity characteristics, are gaining traction in the U.S. market, with issuance hitting a record $35.6 billion this year. A pivotal shift by Moody’s Ratings ...

A successful debut for a new type of hybrid bond is boosting expectations for a burgeoning asset class — one that has been hailed as the key to unlocking billions of dollars to fund development ...

Technical paper titled “Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests” from researchers at TU Dresden and others. Find the open access technical paper here.

Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...

SoftBank Group Corp. set terms for a ¥200 billion ($1.3 billion) hybrid bond at a coupon of 4.556%, topping Japan Airlines Co.’s perpetual subordinated notes and setting the highest coupon for a ...