The SiE726DF emerges as the industry's first 30V monolithic power MOSFET with integrated Schottky diode in a package with top and bottom heat dissipation paths. Available in the company’s PolarPAK ...
Learn more about TI’s latest GaN power ICs and the role that double-sided cooling plays in improving power efficiency and density. Higher switching frequencies with GaN give you the ability to use ...
NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...
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