Many chipmakers face a difficult trade-off — improve quality without affecting yield. Traditional testing methods fail to navigate this challenge due to their limited visibility below the pass/fail ...
In addition to surface and subsurface defects, residual stress represents a concern. Over time, these stress points, ...
isixsigma on MSN
A Step-by-Step Guide: How to Calculate Your Process Sigma
How do you calculate your Process Sigma? Determining the lowest acceptable defect rate in your production is a way to ...
This article is the second in a series from PDF Solutions on why adopting big data platforms will transform the compound semiconductor industry. The first part “Accelerating silicon carbide (SiC) ...
The $10 million he's reportedly receiving in severance pay must soften the blow, but I can't help but assume ex-Intel CEO Pat Gelsinger must surely feel the sting of Intel's current situation and all ...
Portable 3D optical inspection with 4Di InSpec transforms surface metrology, enhancing defect detection and quality assurance ...
TSMC is working to optimize its 2nm (N2) technology by reducing variability and defect density, as the manufacturer aims to begin mass production of 2nm process chips in the second half of next year.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback