Cadence Automates PCB Design With AI Super Agents

Cadence is rapidly deploying "Super Agents" to offer agentic AI support, now with AuraStack, for Printed Circuit Board and ...

Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design

Rapidus Corporation and Cadence (Nasdaq: CDNS) today announced a collaboration to advance agentic AI for advanced-node system-on-chip (SoC) design by integrating the Cadence® InnoStack™ AI Super Agent ...
Verdict on MSN

Cadence launches agentic AI platform AuraStack AI Super Agent

The AI-native environment is designed to streamline PCB and advanced packaging design from start to finish.

Cadence Expands AI Agents With AuraStack For PCB And Advanced Chip Packaging

Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just ...
TMCnet

Cadence Introduces AuraStack AI Super Agent, the World's First Agentic AI Platform for PCB and Advanced Packaging

Cadence (Nasdaq: CDNS) today introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging ...

Cadence extends its AI agents beyond chips with AuraStack for circuit boards and packaging

Integrated circuit and electronic hardware design company Cadence Design Systems Inc. today announced a new artificial ...

Cadence rolls out AI agent to speed circuit board, chip packaging design

By Stephen Nellis SAN FRANCISCO, July 15 (Reuters) - Cadence Design Systems on Wednesday launched an artificial-intelligence ...
Nasdaq

Cadence Unleashes ChipStack AI Super Agent, Pioneering a New Frontier in Chip Design and Verification

World’s first AI-powered super agent autonomously creates and verifies designs from specifications and high-level descriptions SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today ...